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Background

Dae Young Jung received B.S. and M.S. degrees in metallurgical engineering from Seoul National University, Korea, and his doctorate in physical metallurgy from the University of Illinois, Champaign-Urbana, Illinois. Jung joined °®¶¹´«Ã½ in 2007. He has extensive experience in the design and manufacturing process for printed circuit boards, semiconductor packaging, CMOS BEOL integration, electronic interconnect materials, reliability evaluation of electronic products, chip-package-interaction (CPI) evaluation, materials characterization and analysis using electron optical instruments. He is also a visiting professor in the Watson School of Engineering and Applied Science at °®¶¹´«Ã½. Since 2009, he has been collaborating with Advanced Semiconductor Engineering Corp. Jung was a research staff member at a nuclear fuel fabrication development laboratory of Korea Atomic Energy Research Institute until 1976. He was an R&D scientist for semiconductor and packaging technology development at IBM for 25 years until his retirement in 2007.