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Background

Peter Borgesen was born and educated in Denmark, worked in national laboratories there and in Germany, and came to Cornell University in 1986. During 8 years of research in the department of Materials Science and Engineering he developed, among other, a particular interest in the assessment of microelectronics reliability at both the chip and the packaging level. As a result he was recruited by Universal Instruments in °®¶¹´«Ã½ where he ended up managing a multimillion dollar manufacturing research effort conducted by a team of staff and graduate students and sponsored by an international consortium of companies from across the electronics industry. After 15 years at Universal Instruments he finally joined °®¶¹´«Ã½ in January 2009. He continues to maintain strong relations with industry but has also secured government funding for his ongoing research on electronics packaging.

Education

• MSc, PhD, University of Aarhus, Denmark

Research Interests

• Manufacturing processes and reliability
• Current emphasis on electronics packaging and flexible hybrid electronics reliability
• Cross-disciplinary experimental research (materials science, mechanics, industrial engineering), practical guidelines and models, incomplete data interpretation, statistics